
Terahertz Monolithic Integrated Circuit – photo courtesy of Northrop Grumman

Approximately 30-nanometer Indium Phosphide T-gate, photo courtesy of Northrop Grumman
The goal of DARPA’s Terahertz Electronics program is to develop the critical device and integration technologies necessary to realize compact, high-performance, electronic circuits that operate at center frequencies exceeding 1.0 THz. Managed by DARPA’s Microsystems Technology Office, the program focuses on two areas – terahertz high-power amplifier modules, and terahertz transistor electronics. “The success of the THz Electronics program will lead to revolutionary applications such as THz imaging systems, sub-mm-wave ultra-wideband ultra-high-capacity communication links, and sub-mm-wave single-chip widely-tunable synthesizers for explosive detection spectroscopy,” according to Dr. John Albrecht, THz Electronics program manager for DARPA.
A transistor amplifier magnifies input signals to yield a significantly larger output signal. In 2007, Northrop Grumman set a new world record for transistor speed with an ultra-fast device to provide much higher frequency and bandwidth capabilities for future military communications, radar and intelligence applications. The company produced and demonstrated an indium phosphide-based High Electron Mobility Transistor (InP HEMT) with a maximum frequency of operation of more than 1,000 gigahertz, or greater than one terahertz.


