On August 8, 2026, Teledyne Technologies Incorporated announced plans to showcase its integrated defense, space, and advanced sensing portfolio at the upcoming 2026 Space and Missile Defense (SMD) Symposium in Huntsville, Alabama.
The scheduled exhibit will demonstrate the company’s capabilities across the national security and space exploration lifecycle, emphasizing radiation-hardened microelectronics, infrared tracking sensors, and mission integration for missile defense architecture.
Exhibiting in Booth 711 in the South Hall during the upcoming event, Teledyne will unify capabilities from across its corporate subsidiaries, including Teledyne Brown Engineering and Teledyne FLIR Defense, to address multi-domain requirements in high-radiation space and theater defense environments.
Sensing Technologies and Microelectronics Hardware Specifications
The upcoming technical showcase will feature specialized hardware engineered for harsh space operations and defense platforms, including:
- Visible imaging sensors, detectors, and space-qualified optical cameras designed for low Earth orbit (LEO) and geostationary orbit (GEO) space domain awareness missions.
- Infrared sensing arrays, radiometric calibration tools, and missile tracking payloads built for early warning and target discrimination systems.
- Radiation-hardened semiconductors, high-reliability microelectronics, and advanced microelectronic packaging developed for high-radiation orbital regimes.
- Mission-critical power generation hardware, incorporating thermoelectric systems, fuel cells, and hydrogen power units for long-duration space vehicles and isolated installations.
The planned technology displays build on Teledyne’s ongoing support for major defense programs, including spacecraft engineering subcontracts for the U.S. Space Force and advanced infrared imaging payloads developed by Teledyne FLIR Defense.
“Teledyne’s strength lies in our ability to deliver mission-critical technologies across the defense and space ecosystem,” said Scott Hall, President of Engineered Systems at Teledyne. “By combining expertise in sensing, imaging, microelectronics, advanced packaging, power systems, and systems integration, we provide customers with trusted technologies that enable success in the world’s most demanding environments.”
Lifecycle Systems Engineering and Mission Integration Roadmap
Beyond component-level hardware, Teledyne Brown Engineering will present its full-spectrum systems engineering, software development, and mission integration capabilities at the symposium. The company provides prime contractors and government agencies with system prototyping, assembly, integration, and testing (AIT), delivering end-to-end mission architecture for missile defense interceptors, tactical threat detection networks, and deep space exploration programs.
