The milestone continues Raytheon‘s 40-year history of on-orbit success. Activation also marks the beginning of the year-long TacSat-3 mission to test the payload’s ability to deliver tactical surveillance information from space to military field commanders within 10 minutes of data acquisition. ARTEMIS was developed in 15 months as an experiment in rapid deployment funded by a $15 million contract from the laboratory. Data collection is scheduled to begin within days as part of the program’s goal of demonstrating the ability to design, build and field space solutions in tactically relevant time frames. Consisting of a trio of components (telescope, spectrometer and on-board digital signal processor), the payload will image the ground at high spatial resolution in a broad range of the visible and infrared spectrum. It can be directed to search for camouflage, disturbed earth and other signs of enemy activity. With its easily manufactured and readily repeatable design, ARTEMIS serves as the model for the electro-optical class of Responder™ modular payloads recently introduced by Raytheon. Responder combines a common payload framework with a suite of interchangeable mission-specific sensors and standardized interconnects to allow for rapid design, manufacturing and spacecraft integration of space payloads.
For Raytheon, It’s All About The Image
Raytheon Company (NYSE: RTN) has received confirmation from the U.S. Air Force Research Laboratory that its hyperspectral imaging sensor known as ARTEMIS has been activated aboard the TacSat-3 spacecraft and is fully functional.
The milestone continues Raytheon‘s 40-year history of on-orbit success. Activation also marks the beginning of the year-long TacSat-3 mission to test the payload’s ability to deliver tactical surveillance information from space to military field commanders within 10 minutes of data acquisition. ARTEMIS was developed in 15 months as an experiment in rapid deployment funded by a $15 million contract from the laboratory. Data collection is scheduled to begin within days as part of the program’s goal of demonstrating the ability to design, build and field space solutions in tactically relevant time frames. Consisting of a trio of components (telescope, spectrometer and on-board digital signal processor), the payload will image the ground at high spatial resolution in a broad range of the visible and infrared spectrum. It can be directed to search for camouflage, disturbed earth and other signs of enemy activity. With its easily manufactured and readily repeatable design, ARTEMIS serves as the model for the electro-optical class of Responder™ modular payloads recently introduced by Raytheon. Responder combines a common payload framework with a suite of interchangeable mission-specific sensors and standardized interconnects to allow for rapid design, manufacturing and spacecraft integration of space payloads.
The milestone continues Raytheon‘s 40-year history of on-orbit success. Activation also marks the beginning of the year-long TacSat-3 mission to test the payload’s ability to deliver tactical surveillance information from space to military field commanders within 10 minutes of data acquisition. ARTEMIS was developed in 15 months as an experiment in rapid deployment funded by a $15 million contract from the laboratory. Data collection is scheduled to begin within days as part of the program’s goal of demonstrating the ability to design, build and field space solutions in tactically relevant time frames. Consisting of a trio of components (telescope, spectrometer and on-board digital signal processor), the payload will image the ground at high spatial resolution in a broad range of the visible and infrared spectrum. It can be directed to search for camouflage, disturbed earth and other signs of enemy activity. With its easily manufactured and readily repeatable design, ARTEMIS serves as the model for the electro-optical class of Responder™ modular payloads recently introduced by Raytheon. Responder combines a common payload framework with a suite of interchangeable mission-specific sensors and standardized interconnects to allow for rapid design, manufacturing and spacecraft integration of space payloads.
