Targeting the requirement for high-performance imaging in austere environments, Teledyne Technologies will present a unified ecosystem of sensing solutions at the upcoming SPIE Defense + Security 2026 conference.
The exhibition, taking place April 26-30 at the Gaylord National Resort & Convention Center in Maryland, will feature technical contributions from across the Teledyne portfolio, including Teledyne e2v, DALSA, FLIR IIS, and Lumenera.
Debut of the Caiman Imaging Module
A centerpiece of the Teledyne exhibition at Booth 703 is the newly announced Caiman imaging module. Released on April 21, 2026, the module is designed for low-light applications such as night vision, tactical surveillance, and scientific imaging. Built around the OnyxMax sensor, the system addresses current industry gaps in SWaP-C (size, weight, power, and cost) optimization for portable and drone-based sensing platforms.
Technical specifications for the Caiman module include:
- Sensitivity: Capable of high-resolution performance in conditions below 1 mlx.
- Power Consumption: Operates below 1W, allowing for extended battery-powered deployment.
- Performance: Supports speeds exceeding 120 fps to reduce system latency for real-time visualization.
- Interface: MIPI-based integration for compatibility with standard System on Chips (SOCs).
Unified Sensing Infrastructure
The “united ecosystem” approach reflects a strategic consolidation of Teledyne’s vertically integrated imaging technology. Visitors will witness a range of sensors spanning the near-infrared (NIR) and long-wave infrared (LWIR) spectral bands. The goal of this modular architecture is to simplify the procurement and integration process for government and security force projects, allowing for software-defined sensor fusion across different mission profiles.
In addition to hardware displays, Ariane Le Bon, Marketing Manager at Teledyne Imaging, is scheduled to present technical findings on low-light imaging modules during the industry stage sessions. These presentations focus on the engineering challenges of the next era of photonic integration in defense and security applications.
Exhibition Schedule and Location
The SPIE Defense + Security exhibition floor will be open for three days during the week-long technical program:
- Tuesday, April 28: 10:00 AM – 5:00 PM
- Wednesday, April 29: 10:00 AM – 5:00 PM
- Thursday, April 30: 10:00 AM – 2:00 PM
Teledyne representatives will be available at Booth 703 to discuss integration timelines and the availability of evaluation software for the Caiman module and other NIR sensing systems.
